Heat Pipe Enables Fanless Cooling October 02, 2008
The company’s latest range of flat heat pipes promises fast removal of heat up to 310W directly from the source and transfers it to the chassis or an external heat sink. Housed in an aluminum package measuring 1.2 mm to 2.5 mm in thickness, the component can eliminate the fan, heat sink, and thermal pad in many applications. This translates into reductions in power consumption, noise output, product thickness, and cost. Reportedly, very little heat transfers to components between the source and the chassis. The heat pipes are also available with sleeves for electrical insulation. Typical applications include cooling LCD and plasma displays, LED lighting, CPUs, memory components, and hard-disk drives. For further information, call GELMEC UK, Great Yarmouth, England. +44 (0)1493 668622.
