Edge-Pad Conditioners Advance 32-nm Fabrication August 29, 2008
Embarking as a solution for controlling pad texture in 32-nm wafer fabrication applications, the DIAMONEX PHOENIX next-generation edge-pad conditioner for chemical mechanical polishing (CMP) reportedly produces highly consistent and fine pad textures required for advanced process nodes. According to the company, the conditioners deliver CMP pad surfaces with significantly smaller asperities and more consistent pad texture than pad conditioners utilizing traditional diamond crystals or grit. Contact is via the edges of a proprietary ceramic substrate with elevated surfaces coated with CVD diamond. In laboratory tests, the pad conditioners achieve a 30% higher material removal rate on blanket copper wafers compared to conventional pad conditioners. For more details, call MORGAN TECHNICAL CERAMICS INC., Fairfield, NJ. (800) 433-0638.
