Thermal Putty Keeps High Power Devices Cool March 21, 2008
Said to be one of the most efficient methods for transferring heat from high-power semiconductors to nearby heat sinks and chassis walls, GR-Pm thermal interface putty is a silicone-based material that is very conformable and exhibits a low compression force at compression rates up to 90%. The putty is suitable for filling small air gaps and uneven mating services as small as 0.3 mm. It complies with UL 94 V-0 flame-retardant specifications and is available in sheets or die-cut forms up to 300 mm x 200 mm. Other features include a thermal conductivity of 6 W/m°K with a thermal resistance ranging from 0.32 to 0.08°Cin.2/W depending on application compression. For pricing, call FUJIPOLY AMERICA CORP., Carteret, NJ. (732) 969-0100.
