Thermal Material Tempers Next-Gen Mobile Processors September 14, 2007
Formulated for next-generation Intel mobile microprocessors, T777 polymer solder hybrid (PSH) thermal interface material is said to exhibit superior thermal properties, enhanced thermal stability, and excellent long-term reliability. The material is optimized for Intel's Santa Rosa platform, Merom CPU, and verified with the Yonah test vehicle. The T777 pads are readily re-workable during assembly and, unlike traditional phase change materials, PSH materials incorporate low-melt metal alloy fillers and polymer systems to maximize thermal conductivity, thermo-oxidative stability, and surface wetting during flow. Reaching the required burn-in temperature above 64°C, the pad flows attain a minimum bond-line thickness of less 0.025 mm and achieve a minimum thermal impedance of 0.03°C-cm2/W. Additionally, long-term aging tests conclude that T777 does not exhibit dry-out issues common to thermal grease and demonstrates just a small change in end-of-life thermal performance after five years at 70°C. CHOMERICS, Woburn, MA. (781) 935-4850.
