High Frequency Reed Relay Module Supports Multiple I/O Options June 2007 Issue Published Date: May 03, 2007
The RM series reed relay module provides three I/O options: four inputs with one, two, and four outputs, packed within a rugged thermoset epoxy over-molded FR-4 substrate measuring 0.157" in height. Capable of switching beyond 3 GHz with a less than 40 ps rise time, the relay module is capable of billions of switching operations. Its leadless surface-mount design eliminates skewing and co-planarity concerns. The short BGA terminals create a short signal path that makes the component suitable for RF applications and reflow processes with temperatures up to 260°C. Pricing is under $10 each in production quantities. MEDER ELECTRONIC INC., Mashpee, MA. (508) 539-0002.
