Samtec Introduces Elevated High-Density Arrays April 26, 2007
The HD Mezz elevated high-density interconnects, HDAM and HDAF series, provide a solid grid of contacts on a 1.2 mm x 2 mm pitch with up to 299 signal/ground contacts or 92 signal pairs. The connectors are available with 20-mm, 25-mm, 30-mm, and 35-mm stack heights with other sizes under development and application specific stack heights available upon request. The components employ an open-pin-field design that allows the connector to be routed single-ended or differentially. Final Inch Breakout Region Performance Certified printed-circuit board layout models are available with performance levels up to 3.4 GHz single-ended and up to 4.4 GHz per differential pair depending upon stack height and signal-to-ground ratios. Pricing begins at 0.09ยข per pin. SAMTEC INC., New Albany, IN. (800) 726-8329.
