Epoxy Resin Boosts Thermal Conductivity April 2007 Issue Published Date: April 09, 2007
Promising high flexibility and thermal conductivity, the EP21TDC-2LO epoxy resin cures at room temperatures, more rapidly at elevated temperatures, and has a 1-to-3 mix ratio by weight or volume. Working life is greater than 90 minutes for a 100g mass. Little exotherm is said to develop during curing, making the material suitable for use in thick and thin sectioned configurations. Meeting NASA low outgassing specifications, EP21TDC-2LO has a service operating temperature range of 4K to 250°F, Shore D hardness of 36, and an elongation in excess of 50%. Other features include a tensile strength of 1,070 psi, T-peel strength of more than 15 pli, and a tensile shear strength for aluminum-to-aluminum bonds in excess of 980 psi. Additionally, volume resistivity is greater than 1,012W-cm and thermal conductivity is 9 BTU/in./ft.2/hr./°F. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.
