DDR2 Memory Modules Keep A Low Profile May 2007 Issue Published Date: April 05, 2007
EMBEDDED SYSTEMS CONFERENCE, San Jose, CA. – Sporting very low profiles, the DDR2 Very Low Profile (VLP) and DDR2 Ultra Low Profile (ULP) blade memory modules for embedded computing applications provide what are said to be significant enhancements to the JEDEC standard, including reduced module height and densities up to 4 GB. The ULP memory module series offers DIMM heights of 0.7", enhanced from the JEDEC standard of 0.72". All VLP and ULP memory modules are available with an extended temperature range and are suitable for use as AdvancedTCA memory, AdvancedMC memory, MicroTCA memory, PicoTCA memory, and AMC memory in blade applications and in PICMG single-board computers. VIRTIUM TECHNOLOGY, (888) 847-8486.
