Material Combines EMI Shielding And Thermal Management March 2007 Issue Published Date: December 13, 2006
Thermally Enhanced Board Level Shielding (T-BLS) is a RoHS-compliant, single assembly that combines two different technologies into one product. This allows the material to provide both thermal management and EMI shielding. The T-BLS system relies on the company's T-flex 600 Series thermal gap filler--a soft, compressible material with high thermal conductivity. Fitting between a component and a board-level shield, the filler eliminates air gaps and reduces the overall thermal load. The material is available in custom shapes and thermal-interface materials. Pricing for a 1" square shield with T-flex 600 Series thermal gap filler is $0.40 each/100,000. Smaller quantities are generally priced at $0.75 each. LAIRD TECHNOLOGIES, St. Louis, MO. (800) 843-4556.
