Partnership Forecasts Unique FPGA Packaging November 22, 2006
Announced as the first cooperative agreement of its kind in the programmable logic industry, White Electronic Designs will be teaming with Altera to create a broad variety of packaging options for FPGAs that meet the requirements of defense and aerospace applications. White Electronic will wrap Altera FPGA die in package types that include small form-factor monolithic plastic and ceramic, chip-on-board, multichip modules, stack, and system-in-a-package. Options will support 90-nm Stratix II and Cyclone II FPGA families while support for next-generation, 65-nm devices looms on the horizon. WHITE ELECTRONIC DESIGNS CORP., Phoenix, AZ. (602) 437-1520.
