Gore’s Thermal Material Goes Silicon Free October 23, 2006
Enhancing capabilities of the POLARCHIP family of thermal interface materials, the SF3000 is described as a truly soft, silicone-free thermal gap pad. The absence of silicone promises to eliminate the problems of outgassing and oil migration, a.k.a., bleeding. Highly compressible, the thermally conductive material is suitable for filling air gaps between heat generating devices on printed circuit boards and heat sinks, heat spreaders, and metal chassis. It is a fluoropolymer composite consisting of an expanded polytetrafluoroethylene matrix filled with boron nitride particles. W. L. GORE & ASSOCIATES INC., Elkton, MD. (800) 445-4673
