Die Attachment And Mold Compound Go Pb Free September 2006 Issue Published Date: September 18, 2006
Commercially available, Hysol QMI529LS die-attach material and Hysol GR828A mold compound are lead-free compatible and designed for thin and ultra-thin surface-mount device applications. Hysol QMI529LS employs a unique formulation that provides hydrophobic properties while maintaining stability at extremely high temperatures. The Hysol GR828A is a low-stress molding compound that exhibits reliable gate leakage performance. Both materials are tested to JEDEC Level 1, 260°C. For further information and pricing, call HENKEL LOCTITE CORP., Rocky Hill, CT. (888) 943-6535.
