SMT Connectors Ease Board-Stacking Apps September 2006 Issue Published Date: September 18, 2006
The latest line of B2B high-density, SMT connectors assume position as the industry's most robust solution for 1.27-mm pitch, board-stacking applications. The components employ screw-machined terminals with multi-finger contacts and the company's proprietary solder-ball terminal design. With a current rating of 3A per pin, more contacts are assignable for data/signal transfers while relegating fewer pins for power/ground chores. Other features include a redesigned molded LCP insulator that promises a more rugged and durable contact system for blind mating applications. ADVANCED INTERCONNECTIONS CORP., West Warwick, RI. (800) 424-9850
