Test Socket Handles Packages Up To 55 mm² December 2004 Issue Published Date: January 06, 2005
The BGA/CSP test and burn-in socket accommodates IC packages up to 55 mm² and is suitable for test frequencies up to 1 GHz. The device is built on a standard molded-socket format and can be used for a wide variety of package types: CSP, microBGA, DSP, LGA, SRAM, DRAM and Flash memories with a 50-mm pitch or larger. A spring-loaded pressure pad applies force against the DUT after the socket lid is closed and latched and the cam is in position. Reversing the cam removes the force prior to unlatching the lid. Mounting to a burn-in board via solderless pressure-mount compression springs is accomplished accurately using two plastic alignment pins and secured with four stainless steel screws. The signal path during test is 1.92 mm. At pitches above 0.8 mm and using a large probe, 1 dB of bandwidth can be achieved at 1 GHz. The operating temperature is -55°C to 150°C, and estimated contact life is 500,000 cycles. Pricing starts at $1,174.50 each/10. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.
