LTCC Ceramic Substrates Stop Heat Buildup November 2004 Issue Published Date: November 17, 2004
Ceramic substrates with mini cooling tunnels combined with LTCC (low temperature co-fired ceramic) construction can dissipate heat in critical component applications. The thick-film printing and ceramic substrate processes produce a temperature-controlled package. The cooling tunnels built into the substrate draw heat away from the critical components with or without forced-air cooling. MINICAPS INC., Mission Viejo, CA. (949) 305-8126.
