Epoxy Mold Secures SIPs On Laminates September 2004 Issue Published Date: September 24, 2004
For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and flip-chip array packages that have been under filled. The compound is said to exhibit a flat nature that allows the entire package to be processed in a non-warped state. Other features include low warpage, the ability to under fill small ICs and passive components, and reliable adhesion to various laminate substrates. Furthermore, the epoxy is a non-antimony, non-bromine, and non-phosphorous molding compound capable of achieving JEDEC Level 2 requirements (depending on substrate) at a reflow temperature of 260°C. HENKEL LOCTITE CORP., Rocky Hill, CT. (716) 372-6300.
