Thermal Pad Fills Gaps June 2004 Issue Published Date: June 08, 2004
A new electrically isolating gap-filling material has been designed for high-performance applications. Gap Pad 2000S40 has a 2.0 W/mK thermal conductivity for exceptionally low thermal resistance. For greater ease of application and use, the pad’s natural inherent tack eliminates the need for an additional adhesive coating that may inhibit thermal performance by increasing interfacial resistance. Its soft and compliant resin formulation is suitable for fragile components, yet the company claims it does not crumble, flake, tear or come apart. A special resin material that is easy to pull from the liner and place in the application enhances handling. Endowed with stress absorbing flexibility, the Gap Pad 2000S40 is reinforced with a fiberglass carrier on one side for easy handling and enhanced puncture, shear, and tear resistance. Die-cut parts of many shapes or sizes are sized in 20 mil to 125 mil thickness. Standard sheet size is 8" x 16". High volume pieces measure 1" x 1" x 0.020". Pricing is $0.19/2,500. THE BERGQUIST COMPANY, Chanhassen, MN. (800) 347-4572.
