BGA Sockets Get The Lead Out June 2004 Issue Published Date: June 08, 2004
Complying with the Restriction of Hazardous Substances directive and other worldwide initiatives for lead-free manufacturing, the company now offers lead-free solder ball terminal options on select BGA sockets. The 1-mm pitch sockets are molded from high-temperature, glass-filled thermoplastic and are capable of withstanding the 276°C processing temperatures required in lead-free processing. They come in molded LCP wafers for both surface mount and thru-hole applications. The surface-mount sockets feature solder ball terminals made from a tin/silver/copper alloy with a reflow temperature of 218°C. Grid wafers are pin loaded to the exact footprint specified and are available in any pattern up to 26 x 26 rows for BGA, LGA, or CSP devices as large as 27 mm square. Additional sizes and lead-free 1.27 mm pitch sockets will also be available in the near future. ADVANCED INTERCONNECTIONS CORP., West Warwick, RI. (800) 424-9850.
