RF LDMOS Transistors Turn Down The Heat May 2004 Issue Published Date: May 03, 2004
A number of devices, which are said to exhibit the industry’s lowest junction temperatures, have been added to the GOLDMOS line of RF power LDMOS. According to the company, these latest thermally enhanced devices specify a 15% to 30% lower thermal resistance than comparable devices. They will be denoted by an E or F suffix in the part number and added to existing GOLDMOS lines for broadcast, cellular, DCS, PCS, and UMTS applications. The first devices are in production and available now at no extra cost. INFINEON TECHNOLOGIES, Morgan Hill, CA. (408) 776-6000.
