BGA Sockets Accept 13-mm Square Chips September 2003 Issue Published Date: September 18, 2003
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, pressure-mount compression spring probes that are accurately located by two molded plastic alignment pins and held with four stainless steel screws. Capable of surviving up to 500,000 cycles, the spring probe contacts deliver 9g to 12g of pressure per contact for 0.5 mm to 0.75 mm pitches and 17g to 20g per contact for 0.8 mm pitches and greater. Operating temperature ranges from -55°C to 150°C. Additionally, the sockets are available in custom materials, plating, sizes, and configurations. Single-unit price for a 100-lead socket is $175, with delivery time of two weeks ARO. For more details, contact Frank Folmsbee at ARIES ELECTRONIC INC., Frenchtown, NJ. (908) 996-6841.
