Termination Arrays Housed In SMT Package June 2003 Issue Published Date: June 01, 2003
Featuring power ratings from 0.5W (0865 ball grid package) to 1.6W (1065 ball grid package), the CHC series of termination arrays are suited for use in portable products and high-speed switches that require superior electrical performance. The chip-scale termination arrays have eutectic solder bumps on a ceramic substrate, delivering low parasitic inductance and capacitance values. The construction leads to a reduced ground bounce, improved speeds and more consistent propagation delays. The chip-scale arrays are issued in standard 5.1 mm and 6.4 mm lengths with 0.64 mm height, 0.65 mm ball pitch, and a width of 2.5 mm. They also feature absolute TCRs to ±100 ppm/°C, tracking TCRs to ±10 ppm/°C, and tolerances to ±1%. Operating temperatures extend from -40°C to +85°C. INTERNATIONAL RESISTIVE CO., Corpus Christi, TX. (361) 992-7900.
