FET Squeezed Into New, Ultra-Small Package April 2003 Issue Published Date: April 01, 2003
In squeezing a 20V dual bi-directional power MOSFET in a common drain configuration into the company's proprietary FlipFET package, the FET is made 80% smaller than in a TSSOP-8 package. The IRF6156 FET's small size—includes a profile of less than 0.8 mm—makes the device ideal for Li-ion battery pack safety and protection circuits for cell phones, notebook computers, PDAs and digital cameras. FlipFET packages use no-lead frames or mold compounds, with the die, in essence, being the package. This reduces thermal resistance from junction-to-pc board to 35°C/W compared to greater than 60°C/W for SO-8 devices. And since all of IRF6156’s terminals are on a single side of the die, stray inductance and other packaging losses are minimized or eliminated. Pricing starts at $0.80 each/10,000. For more details, contact Joe Engle at INTERNATIONAL RECTIFIER, El Segundo, CA. (310) 252-7019.
