Interconnects Meld Conductor Patterns And Other Passives March 2003 Issue Published Date: March 01, 2003
Thin-film, single- and multi-layer high-density interconnects (HDIs) have been developed that integrate conductor patterns and other passive components to form low-noise products with enhanced signal routing and response conditioning characteristics. Jointly developed by the company and a customer, these customized, application-specific resistive devices are primarily designed for use in microwave and hybrid circuitry found in high-performance, low-noise power amplifiers, avionics, and medical instrumentation. Because multi-layer HDIs are built up rather than out, they can achieve dimensions as small as 0.02"x 0.02". They can also be made as large as 4" x 4", with thickness ranging from 0.005" to 0.050". And the devices can employ a number of different substrate materials in designs having up to five layers. For more information, contact Molly Olver at VISHAY ELECTRO-FILM INC., Warwick, RI. (401) 738-9150 ext 131.
