SMT/BGA Rework System Incorporates FIR Technology March 2003 Issue Published Date: March 01, 2003
The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the levels of profiling and process control necessary for the effective rework of advanced packages, including SMDs, BGAs, µBGAs, CSPs and Flipchips. The IR-X400 combines its FIR heating system with a Dual Zone IR PCB pre-heater, with independent component and PCB closed loop temperature control. The rework system is equipped with a new advanced digital controller combined with the ThermoActive V3 software. Standard features include a precision component pick-up, macro-micro Z-axis with rotation, and a precision X/Y table with accurate macro/micro movement. Optional features include the CCTV split-beam prism-based alignment system and additional lenses covering any component combination. PDR SMT/BGA REWORK SOLUTIONS, Sacramento, CA. (877) 700-6085.
