RF Test Sockets Use Thermoelectrics To Keep Cool March 2003 Issue Published Date: March 01, 2003
The company's interposer, Spring Probe and Microstrip Contact RF test sockets are now available with thermoelectric cooling, reportedly eliminating the need for other, more costly methods of thermal control, such as a flow stream system. The cooling system also includes a built-in thermistor to record temperature and a copper heatsink with an integral fan assembly to further boost thermal management capabilities. Test sockets with the new conduction cooling system are suitable for use with BGA, LGA and CSP packages and are typically used with high-power devices requiring exceptional thermal management, such as in military applications. The 63.5 x 63.5 x 88.9-mm sockets can be used with packages up to 27 x 27 mm in size. Price of a 484-lead BGA Spring Probe socket starts at $5,300 each. For more details, contact Frank Folmsbee at ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.
