Epoxy System Insulates With High Thermal Conductivity February 2003 Issue Published Date: February 01, 2003
A new two-part adhesive system is said to offer thermal conductivity in excess of 22 BTU-in./ft.2-hr.-°F. The EP21AN epoxy adhesive system is an electrical insulator with a dielectric strength of >400V/mil and a volume resistivity greater than 1013 ohm-cm. The adhesive has been formulated with a non-critical 1/1 mix ratio, weight or volume. It cures readily at ambient temperatures or more quickly at elevated temperatures. The EP21AN system adheres to a wide range of substrates, including metals, ceramics, glass, and many plastics. Bonds are said to exhibit outstanding dimensional stability, and shrinkage upon cure is claimed to be exceptionally low. The EP21AN two-part epoxy adhesive is available in half-pint, pint, quart, gallon and five gallon quantities. For more information, contact MASTER BOND INC., Hackensack, NJ. (201) 343-8983.
