Mini Connector Targets High-Density Apps November 2002 Issue Published Date: November 01, 2002
A new line of nano-miniature interconnects has been designed for use where very high reliability and very small size and light weight are required. The N-series connectors offer design-in flexibility in terms of size, termination configuration, hardware, and shell plating options. The high-density, dual-row connectors have ruggedized, polarized metal shells for board-to-cable, cable-to-cable, and board-to-board applications. They feature 0.635 mm pitch contacts side-by-side and 0.318 mm offset row-to-row for higher density packaging. The connectors come in horizontal or vertical configurations with pins or sockets in 10 sizes from 9 to 85 contacts. Both SMT and PTH configurations incorporate shell recess areas for solder washout and inspection. The connectors are well-suited for rugged or harsh environments with conditions of extreme high or low temperatures, high vibration and shock. AIRBORN, Addison, TX. (214) 931-3200.
