Component Line Meets Preliminary XFP Specification September 2002 Issue Published Date: September 01, 2002
The company’s line of components, which includes an interface connector, transceiver-cage assembly, and a heatsink assembly, is designed to conform to the preliminary XFP specification by the 10-Gigabit Small Form-Factor Pluggable Module Group. The interface connector is a 30-position version of the 20-position transceiver (PT) connector. The transceiver-cage assembly is precision formed and features a die-cast front flange with an integral multiple-finger EMI gasket fully surrounding the opening. The gasket provides full perimeter contact with the mated transceiver. At the rear of the cage, a conductive foam EMI gasket provides positive contact with the back end of the mated transceiver. The heatsink assembly mounts to the cage with a floating spring-clip attachment that provides sufficient normal force to achieve effective heat transfer without gels or pastes. For further information , call Mike Ratcliff at TYCO ELECTRONICS, Harrisburg, PA. (717) 592-2316.
