Coolers Tout High Heat Pumping Capacity June 2002 Issue Published Date: June 01, 2002
The High Power Density cooling series includes a new class of thermoelectrics designed to do the work of much larger or multiple units. The thermoelectrics have a strong, porch-style lead attachment design and a high heat pumping capacity. Of course, they also enjoy the same solid-state reliability as other thermoelectric modules. Available in both standard and high temperature models, the cooling devices offer heat pumping densities of up to 11.5 W/cm_, said to be double the heat pumping capabilities of standard thermoelectrics. Applications for the High Power Density series include cooling high-powered ICs, lasers, and industrial equipment. For more information, contact Kathy Salvatore at MELCOR, Trenton, NJ. (609) 393-4178.
