Epoxy Bonds And Insulates Microelectronics November 2001 Issue Published Date: November 01, 2001
Tra-Bond 933-1 is a one-component, highly filled, electrically insulating epoxy encapsulant. The product is designed for encapsulating microelectronic devices and is claimed to offer a longer work life and lower moisture sensitivity than other anhydride cured systems. In addition, the materialÕs low coefficient of thermal expansion minimizes stress effects on components and wiring during shock tests. The encapsulant is sold pre-mixed and frozen and has been degassed and treated. For pricing, contact TRA-CON INC., Bedford,MA. (800) 872-2661.
