Encapsulant Isolates Chips April 2001 Issue Published Date: April 01, 2001
Designed for encapsulating chips and other devices, the 933-1 is a one-component, highly filled, electrically-insulating epoxy encapsulant. The formulation is said to offer a longer work life and lower moisture sensitivity than other anhydride-cured systems. It features a low coefficient of thermal expansion, which is said to minimize stress of placed on components and wiring during shock tests.
