Solder-Free Adhesive Suits BGA Rework October 2000 Issue Published Date: October 01, 2000
Claiming to be ideal for BGA rework and repair, these electrically-conductive, solder-free adhesives are supplied as a dry film on a Mylar carrier and are Z-axis conductive. The adhesives are solvent free, which makes them a viable solution for green regulations that require lead-free manufacturing. Another advantage claimed for these adhesives is that they demonstrate three times the durability of traditional solder-attached components. The film adhesives are also said to eliminate many of the concerns associated with solder and paste applications, such as ease of use and environmental concerns.
