Die Attach Adhesives Exhibit Low Bleed October 2000 Issue Published Date: October 01, 2000
These electrically conductive die attach adhesives are designed specifically for plastic ball grid array packaging and matrix style BGA designs. They can withstand higher temperature reflow for lead-less electronic assembly with optimized adhesion, stress, and moisture absorption. Engineered with a low modulus, the materials are suitable for a wide range of die sizes, from 150 x 150 mil square to 1000 x 1000 mil square. In addition, the Ablebond 2000 series adhesives exhibit very low bleed on solder mask surfaces, a critical requirement for fine pitch BGA applications.
