Cooling Plates Chill High-Power Devices June 2000 Issue Published Date: June 01, 2000
Designed for cooling high-power devices such as laser diodes and power transistors, the company's new direct-contact and pipe liquid plates come in two-pass and four-pass configurations measuring 4" x 12" x 0.5" and 5" x 12" x 0.5", respectively. They are based on what is claimed to be a technical breakthrough that allows a direct contact between liquid to cold plate without any pipes. This provides a low thermal resistance of 0.01°C/W at 1.5 gal./min. of flow. The pipe series has the pipe buried half-way into the base plate for better heat transfer. Unit pricing is $50 each in production quantities.
