Ferrite Material Absorbs EMI April 2000 Issue Published Date: April 01, 2000
This flexible material for EMI suppression is suitable for manual and die cutting from sheets or rolls to various sizes and compound structures. The material is attached to any type of surface by pressure sensitive adhesive backing. Applications are CPUs and ICs at the board level. The thickness of the material and the number of layers can be adjusted to fit the level of attenuation needed in specific applications. This material can be applied to board backs to eliminate crosstalk and protect circuits from external radiation. The material can also be used on cases and enclosures, wires, cables and FPCs.
