Heat Pump Assemblies Deliver Up To 30W Of Cooling Power October 1999 Issue Published Date: October 01, 1999
Laser diodes, CPUs, and a host of other devices can be kept running cool with an assembly consisting of a heat pump, heatsink and fan. Heat from a device is transmitted from the pump to the sink and then to the ambient air via the fan. The assemblies come in a range of sizes (from 1.5" x 1.5" x 1" to 6" x 4" x 3") and in cooling capacities of from 5W to 30W.
