Electronic Design
 
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Back Issues >> March 2002 >> Design, Assembly & Test

Assembly Products
   New Materials Vye With Polyimides In Flex Circuit Mart
   Mics/Speakers Abet Speech Recognition
   Silver Conductor Improves Line Loss 30% In LTCC Packages
   Hydrophobic Conductive Adhesive Withstands 260¡C Reflow

Design Products
   Development Kit Accelerates Infiniband System Deployment
   Kit Evaluates SA-1110 StrongARM Apps

Test & Measurement Products
   BERT System Readied For Next Generation Optical Networks
   Portable Spectrum Analyzer Sports Versatile Array Of Accessories
   DSL Protocol Analyzer Operates In-Line On Copper Loop
   Jitter Analysis Module Is Fully Digital
   DSO Triggers On CAN Bus Signals
   DSO Tackles Long Complex Signals And Fast Edges
   DMM Module Brings Precision Measurement To Embedded Apps

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