March 2001 Back Issues

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Back Issues >> March 2001 >> Design, Assembly & Test

Assembly Products
   Encapsulant Suits SMT Applications
   Tape Has Pockets For SMT Devices
   Electronic Data Tags Size And Price Lowered
   Interface Pads Have High Thermal Conductivity
   Micro-Circuits Tap New, Higher Performance Technology
   UV Cure Silicone Encapsulant Protects Fine-Pitch Assemblies
   Wick Soaks Up More Solder Faster
   Cable Repair Kit Includes Heat Gun
   Urethane Foam Protects Portable Devices
   Aluminum Tags Provide Permanent ID
   Evaluation System Puts Transmitters On Fast Track
   Cable-Tie Tool Sports Ergonomic Design
   Upgrade Extends Future Of Rework Station
   Video System Can Be Used To Inspect Difficult-To-See Components
   Unit Spot Welds In A Single Pulse
   Rework System Aligns, Places And Solders Parts
   Solder Inspection Systems Can See Under Components

Design Products
   Development Kit Is Network Ready
   Physical And Mask Verification System Speeds UDSM SoC Designs
   IDE Targets Hitachi SuperH CPUs
   Programmer Outpaces Predecessor By Wide Margin

Test & Measurement Products
   Cable/Harness Tester Covers 256 Points
   Amplifiers Power EMC Tests
   Emulator Speeds Embedded Systems Development
   Updated Emulator Said To Have Unique Features
   Low-Cost System Measures Sound Power
   Resistance Kit Measures ESD Control Materials

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