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Back Issues >> June 2007 >> Design, Assembly & Test

Microcontrollers & Related Chips & SoCs; Optoelectronic Devices; Power Sources; Displays & Indicators; Sensors & Transducers; Cooling Products; Board Level & Modular Products including Single Board Computers; Design, Assembly & Test Products including Microprocessor, Microcontroller and DSP Development Products
Assembly Products
   Heaters Conform To Surface Contours

Design Products
   LabVIEW Module Enlists Blackfin Processors
   MCU-Based Development Board Speeds Low-Power Designs
   ARM Delivers Development Suite For Low-Risk Software Development

Test & Measurement Products
   Agilent Delivers WiMAX Protocol Test For 802.16e 2005
   Tegam’s ARB Family Adds New Member
   System Characterizes Power Semis
   Modules And Chassis Ride PXI Express
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